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Please use this identifier to cite or link to this item: http://umt-ir.umt.edu.my:8080/handle/123456789/7093
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dc.contributor.authorI.AHMAD-
dc.contributor.authorZ.ENDUT-
dc.contributor.authorA.ZAHARIM-
dc.contributor.authorNOOR AZHAM MOHD SUKEMI-
dc.date.accessioned2017-10-04T04:50:20Z-
dc.date.available2017-10-04T04:50:20Z-
dc.date.issued2007-
dc.identifier.urihttp://hdl.handle.net/123456789/7093-
dc.description.abstractThe filter content of two type capillary underfill materials for flip chip packaging were studied using Thermo gravimetric Analyzer (TGA) and Scanning Electron Microscopy (SEM). An epoxy based resin and cyanate ester based resin were subjected to TGA to determine the percentage of filler content and theirs morphology were studied using SEM. The result showed that these two underfills materials have a very similar percentage of filler content which is around 70% and shows a good morphology properties for capillary underfill applicationen_US
dc.language.isoenen_US
dc.publisherJournal of Sustainability Science and Managementen_US
dc.subjectFlip chipen_US
dc.subjectunderfillen_US
dc.subjectfiller contenten_US
dc.subjectmorphologyen_US
dc.subjectSEMen_US
dc.subjectTGAen_US
dc.titleA STUDY OF UNDERFILL MORPHOLOGY AND FILLER CONTENT USING SCANNING ELECTRON MICROSCOPY AND THERMOGRAVIMETRIC ANALYZERen_US
dc.typeArticleen_US
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