A STUDY OF UNDERFILL MORPHOLOGY  AND FILLER CONTENT  USING SCANNING ELECTRON MICROSCOPY  AND THERMOGRAVIMETRIC  ANALYZER

Please use this identifier to cite or link to this item: http://umt-ir.umt.edu.my:8080/handle/123456789/7093

Title:	A STUDY OF UNDERFILL MORPHOLOGY AND FILLER CONTENT USING SCANNING ELECTRON MICROSCOPY AND THERMOGRAVIMETRIC ANALYZER
Authors:	I.AHMAD Z.ENDUT A.ZAHARIM NOOR AZHAM MOHD SUKEMI
Keywords:	Flip chip underfill filler content morphology SEM TGA
Issue Date:	2007
Publisher:	Journal of Sustainability Science and Management
Abstract:	The filter content of two type capillary underfill materials for flip chip packaging were studied using Thermo gravimetric Analyzer (TGA) and Scanning Electron Microscopy (SEM). An epoxy based resin and cyanate ester based resin were subjected to TGA to determine the percentage of filler content and theirs morphology were studied using SEM. The result showed that these two underfills materials have a very similar percentage of filler content which is around 70% and shows a good morphology properties for capillary underfill application
URI:	http://hdl.handle.net/123456789/7093
Appears in Collections:	Journal Articles

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