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http://umt-ir.umt.edu.my:8080/handle/123456789/7093Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | I.AHMAD | - |
| dc.contributor.author | Z.ENDUT | - |
| dc.contributor.author | A.ZAHARIM | - |
| dc.contributor.author | NOOR AZHAM MOHD SUKEMI | - |
| dc.date.accessioned | 2017-10-04T04:50:20Z | - |
| dc.date.available | 2017-10-04T04:50:20Z | - |
| dc.date.issued | 2007 | - |
| dc.identifier.uri | http://hdl.handle.net/123456789/7093 | - |
| dc.description.abstract | The filter content of two type capillary underfill materials for flip chip packaging were studied using Thermo gravimetric Analyzer (TGA) and Scanning Electron Microscopy (SEM). An epoxy based resin and cyanate ester based resin were subjected to TGA to determine the percentage of filler content and theirs morphology were studied using SEM. The result showed that these two underfills materials have a very similar percentage of filler content which is around 70% and shows a good morphology properties for capillary underfill application | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Journal of Sustainability Science and Management | en_US |
| dc.subject | Flip chip | en_US |
| dc.subject | underfill | en_US |
| dc.subject | filler content | en_US |
| dc.subject | morphology | en_US |
| dc.subject | SEM | en_US |
| dc.subject | TGA | en_US |
| dc.title | A STUDY OF UNDERFILL MORPHOLOGY AND FILLER CONTENT USING SCANNING ELECTRON MICROSCOPY AND THERMOGRAVIMETRIC ANALYZER | en_US |
| dc.type | Article | en_US |
| Appears in Collections: | Journal Articles | |
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